Dual-Spectrum Thermal-Visible Inspection System with 160×120 IR Microbolometer and 2.0 MP Visible Camera

Product Overview

The Sugia OmniScope S3 is a dual-spectrum inspection tool that combines an uncooled vanadium oxide (VOx) microbolometer focal-plane array with a separate 2.0-megapixel visible-light CMOS camera in a single 8.5 mm diameter probe head. Unlike general-purpose videoscopes with a “thermal accessory,” the S3 treats the two spectral channels as co-equal data sources with a dedicated fusion engine that overlays thermal data onto visible-light imagery for instantaneous hotspot localization.

The thermal channel uses a 160 × 120 pixel sensor with 12-micron detector pitch, operating in the 8–14 µm long-wave infrared (LWIR) band. This is not a megapixel-resolution camera: it is a radiometric temperature-measurement instrument that reports temperature values for every pixel in the array with ±2 °C or ±2% accuracy (whichever is greater) across a -20 °C to +400 °C measurement range. The thermal field of view is 57° × 44°, matched approximately to the 80° diagonal visible channel FOV for effective image fusion.

The S3’s MSX (Multi-Spectral Dynamic Imaging) fusion engine extracts edge-detail information from the visible-light image and superimposes it on the thermal image, creating a composite that provides both radiometric temperature data and visible-context spatial reference. This is particularly valuable in electrical inspection, where a thermal hotspot on a busbar connection can be simultaneously localized to a specific bolt or clamp in the visible reference image.

Key Engineering Features

• Uncooled VOx Microbolometer: 160 × 120 pixel array, 12-micron pitch, 8–14 µm spectral response; radiometric temperature measurement at every pixel; ±2 °C or ±2% accuracy.
• 2.0 MP Visible-Light Channel: Separate 1/3-inch CMOS sensor with 1920 × 1080 resolution; independent LED illumination ring; captures visual-reference images simultaneously with thermal data for location context.
• MSX Image Fusion Engine: Real-time edge extraction from the visible channel overlaid on the thermal image; user-adjustable fusion blend ratio (0–100% visible contribution) via console touchscreen slider.
• Radiometric Spot and Area Measurement: User-positioned spot meter, rectangular area box (min/max/average temperature), and automatic hot/cold-spot tracking. Isotherm threshold alert with audible alarm when user-defined temperature limits are exceeded.
• CAT IV 600V Safety Rating: Probe and handpiece are certified to IEC 61010-2-030 CAT IV 600V for direct contact with energized electrical conductors in utility switchgear and distribution panels.

Technical Specifications

Parameter	Thermal Channel	Visible Channel
Sensor Type	Uncooled VOx microbolometer	1/3-inch BSI CMOS
Resolution	160 × 120 pixels	1920 × 1080 (2.0 MP)
Pixel Pitch	12 µm	2.0 µm
Spectral Band	8–14 µm (LWIR)	400–700 nm (visible)
Field of View	57° × 44°	80° diagonal
Frame Rate	9 Hz	30 fps
Temperature Range	-20 °C to +400 °C	N/A
Accuracy	±2 °C or ±2%	N/A
NETD	< 50 mK at 30 °C	N/A
Illumination	N/A	White LED ring, 4-stage

System Specifications:

Parameter	Value
Probe Outer Diameter	8.5 mm
Insertion Tube Length	2.0 m
Articulation	None (semi-rigid pre-shapeable)
Fusion Mode	MSX edge-overlay, adjustable blend ratio
Measurement Functions	Spot, area box, auto hot/cold, isotherm alarm
Monitor	7.0-inch IPS touchscreen, 1280 × 800
Storage	64 GB internal flash + SDHC slot
Image Format	Radiometric JPEG (thermal + visible + fusion)
Video Output	HDMI Type C
Battery	7.4 V Li-ion, 48 Wh, ~3 h runtime
Safety Rating	IEC 61010-2-030 CAT IV 600V
Ingress Protection	Probe tip IP67, main unit IP54
System Weight	2.7 kg

Target Applications

• Electrical Distribution: MV/LV switchgear busbar connection thermography during energized condition; circuit-breaker terminal overheating detection; transformer bushing connection temperature surveys; panelboard branch-circuit load-imbalance thermal identification.
• Refractory & Insulation: Furnace refractory hot-spot detection indicating lining thinning or failure; steam-pipe insulation-jacket thermal surveys for energy-loss quantification; kiln shell temperature mapping for refractory-wear trending.
• Building Envelope: Cavity-wall insulation void thermal detection, HVAC duct leakage thermal identification from internal duct surveys, underfloor heating pipe continuity verification.
• Process Equipment: Heat-exchanger tube-bundle temperature-distribution mapping for flow-maldistribution diagnosis; steam-trap thermal performance assessment; rotating equipment bearing housing temperature monitoring through guard apertures.